Hardware overview

The Qualcomm Dragonwing^TM IQ-8275 Evaluation Kit (EVK) has Qualcomm IQ-8275 SoC mounted on the mainboard. Learn more about the system block diagram, electrical design, features, and capabilities of the EVK.

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System block diagram

The following figure shows the system block diagram of the Dragonwing IQ-8275 EVK platform. This figure provides a visual representation of the platform’s architecture, highlighting the main components and their interactions. Figure : Dragonwing IQ-8275 EVK system block diagram

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Hardware specification

The following table outlines the key hardware specification of the Dragonwing IQ-8275 EVK. Note For the list of interfaces supported in this release, see the Qualcomm Linux 2.0 Release Notes. Table : Dragonwing IQ-8275 EVK key specifications

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Exterior view

The following figures show the exterior of the Dragonwing IQ-8275 EVK with the bottom case. Figure : Exterior view of the EVK with bottom case The following figures show the side views of the Dragonwing IQ-8275 EVK, with labeled ports, connectors, and switches. The following figure shows the top view of the core board. Figure : Top view of the core board

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EVK ports and interfaces

The following figure shows a detailed view of all the connectors on the Dragonwing IQ-8275 EVK. Figure : Connectors on Dragonwing IQ-8275 EVK The following figure shows the platform with few cables plugged in. Figure : Platform with cables plugged in Table : Connectors and functions

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DIP switch

The following images show the location of the DIP switches on the mainboard. Figure : DIP switches 1, 2, and 3 on Dragonwing IQ-8275 EVK Note If a DIP switch is facing up, it indicates that the switch is on. The following table details DIP switch operations for the Dragonwing IQ-8275 EVK, including functions and settings for board configuration. Table : DIP switch position and its respective functions

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LEDs

The Dragonwing IQ-8275 EVK has status LEDs that monitor system functions such as power-on and board faults, crucial for debugging and bringup. The following table lists and summarizes the functions of the LEDs. The Connectors on Dragonwing IQ-8275 EVK shows the location and the LEDs present on the board. Table : Summary of reference designator, location, color, and function of LEDs

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Hardware components and interfaces

The following are the high-level details of the Dragonwing IQ-8275 processor, power supply, memory, and various interfaces, such as camera, USB, and DisplayPort. It also includes sensors, flash memory, expansion options, a debug interface, audio support, thermal management, fan control, and accessory boards.

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Processor

The target processor used in the Dragonwing IQ-8275 EVK is the Dragonwing IQ-8275 SoC, also known as the QCS8275. This SoC features an octa-core Kryo^™ Gen 6 CPU built on Arm v8.2 Cortex technology, with clock support up to 2.35 GHz. In addition to the eight high-performance CPU cores, the SoC includes a GPU and a Hexagon Tensor Processor with vector and matrix extensions, enabling the management of various concurrent compute and AI workloads simultaneously. The SoC offers extensive peripheral support, including integrated Ethernet, USB, Wi-Fi, PCIe, and Bluetooth. It’s capable of delivering up to 40 TOPS, making it suitable for powering high-performance, AI-centric, and Edge AI industrial use cases. The target applications include:

• Factory automation
• Industrial robots
• Industrial personal computers
• Drones
• Edge AI Boxes
• Machine Vision
• Autonomous Mobile Robots (AMRs)
• Industrial gateways

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Power

The main power input to the Dragonwing IQ-8275 board is provided through the 2.10 mm barrel jack connector (JPWR, JACK-C-PC-10A-RA(R)), supporting an input voltage range of 12 V to 36 V. The EVK also includes a Type-C to barrel plug adapter. Four power management ICs manage the respective power supplies to various system blocks, including the SoC, PMIC, PCIe, and expansion ports.

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Memory

The IQ-8275 EVK has two 6 GB LPDDR5 SDRAM ICs.

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Camera interface

An analog switch is used for each MIPI CSI interface, allowing the MIPI CSI interfaces to be accessible through both the JCAM camera interconnect receptacle and the B2B expansion connector (JEXP4). To use a GMSL camera with the Dragonwing IQ-8275 EVK, connect it through the GMSL mezzanine, which must be ordered separately. The CSI ports are routed through the DIP switches, allowing configuration and setup. The three MIPI CSI ports operate in either C-PHY or D-PHY mode and support a range of existing cameras and flex cable. The following block diagrams show various CSI interfaces.

Figure : Camera CSI0 interfaces Figure : Camera CSI1 interfaces Figure : Camera CSI2 interfaces

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USB interface

The board features three USB connectors: two Type-C connectors (JUSB0 and JUSB1) and one micro-USB connector (JUSB2). The following figures show the USB interfaces and configuration. USB0-SS interfaces and configuration USB0-HS interfaces and configuration USB2-HS interfaces and configuration USB interfaces and configuration

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DisplayPort (eDP) interface

The target processor is equipped with 1 x eDP interface. EDP0 is routed to LT8713 EDP bridge as shown, with also a BYPASS option to JEDP0. The following figure shows the eDP interfaces and configuration. eDP interfaces and configuration

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DSI interface

The IQ-8275 processor supports one 4-lane MIPI-DSI with VESA DSC v1.2. The Dragonwing IQ-8275 EVK uses an analog switch for DSI0 interface, allowing the interface to be accessible through both the JDISP LCD receptacle and the B2B expansion connector (JEXP1). The following figure shows the DSI connectors Figure : DSI connectors

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Storage interfaces

The Dragonwing IQ-8275 has three types of storage interfaces: secure digital (SD) card, universal flash storage (UFS), and electrically erasable programmable read-only memory (EEPROM).

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SD card

The target processor supports a single SDIO interface (SDC1). The SDC pins are routed through analog switches to facilitate connections through the micro SD card connector (JSDC) on the board, and eMMC (U150). The following figures show the SD card interfaces and configuration. SDIO card interfaces and configuration SD card interfaces and configuration

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UFS

The target processor supports 1 x UFS 3.1 Gear 4 interface. UFS0 serves as the main domain boot-up device. The following table lists the part numbers and manufacturers of these UFS devices. Table : Part numbers and manufacturers of UFS devices The following figure shows the UFS interfaces and configuration. UFS interfaces and configuration

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EEPROM

The Dragonwing IQ-8275 EVK platform has a single EEPROM device dedicated to storing MAC addresses for Ethernet, Wi-Fi, and Bluetooth. The following table lists the part number and manufacturer of the EEPROM device. Table : Part number and manufacturer of the EEPROM device

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On-board sensors

The Dragonwing IQ-8275 EVK platform includes an on-board IMU and a temperature sensor. They are connected to the real-time subsystem (RTSS) domain of IQ-8275 EVK. Note Currently, the software doesn’t support the IMU and temperature sensors. Contact Qualcomm software team for details if you wish to enable them. The following table lists the part numbers and manufacturers of these sensors. Table : Part numbers and manufacturers of the sensors

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PCIe interface

The target processor supports two PCIe interfaces: PCIe0 and PCIe1. PCIe0 is Gen4 2-lane and PCIe1 is Gen4 4-lane PCIe interface. Both PCIe interfaces are connected to an A/B switch, which by default, connects them to the expansion mezzanine. For DIP switch settings, see the Table: DIP switch position and its respective functions. The following figures show the PCIe interfaces and configuration. Figure : PCIe0 interfaces and configuration Figure : PCIe1 interfaces and configuration

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Flash memory

The Dragonwing IQ-8275 EVK uses OSPI interface to support 2GBIT flash memory. The analog switch for OSPI interface allows the interface to be accessible through both the flash memory device and the B2B expansion connector (JEXP2). Note Due to the analog switch, you can connect the OSPI to the memory device or to B2B connector through DIP switch settings. For the intended OSPI settings, see the Table: DIP switch position and its respective functions. The following figure shows the flash memory interfaces and configuration. Figure : Flash memory interfaces and configuration The main board provides CAN0, and the JEXP1 connector provides CAN1-7. The following figures show controller area network (CAN) block diagram and interfaces. Figure : CAN0 interfaces

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Expansion headers

The Dragonwing IQ-8275 EVK features four high-speed expansion connectors (JEXP1-4, 10139781-121422LF). Connect accessory cards such as GMSL mezzanine and RBx adapters to these connectors. Additionally, other interfaces mentioned throughout this document are also routed to these connectors, see the Connectors on Dragonwing IQ-8275 EVK. The following table details the pin mapping for the JEXP1 connector. Table : Pin mapping for the JEXP1 connector The following table details the pin mapping for the JEXP2 connector. Table : Pin mapping for the JEXP2 connector The following table details the pin mapping for the JEXP3 connector. Table : Pin mapping for the JEXP3 connector The following table details the pin mapping for the JEXP4 connector. Table : Pin mapping for the JEXP4 connector

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Debug interface

The platform includes a micro-USB connector receptacle (JTAC, part number: 0475890001) connected to an FTDI chip (U19, part number: FT4232HL-REEL), which is used for debugging purposes. For the location of the debug interface connector on the platform, see the Connectors on Dragonwing IQ-8275 EVK.

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JTAG interface

The JTAG connector header on the board is a 20-position pin interconnect with a 0.050” (1.27 mm) pitch and 0.050” (1.27 mm) row spacing. The reference designator for the JTAG connector component is JTAG, and its part number is FTSH-110-01-L-D-RA-K. To use a traditional JTAG connector, an adapter such as the 65-PM339-1 may be required. For the location of the JTAG connectors on the platform, see the Connectors on Dragonwing IQ-8275 EVK.

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Audio

For speaker and audio support, the HS0_MI2S interface is used for the two onboard audio amplifiers, and the HS2_MI2S interface is used for the I²S microphone on the mainboard. Both interfaces can optionally be switched to the mezzanine connectors for expansion purposes. Consider the following details about speakers and microphones on the device:

• Speakers: Onboard speakers (with MAX98357 I²S-amps); HS0_MI2S is shared between both left and right speakers to enable stereo sound.
• Microphones: The EVK includes a single onboard microphone (MMICT5848) that uses the HS2_MI2S interface. By default, the microphone is configured to the left channel.

The following figure shows the audio connections. Figure : Audio connections The following figure shows the Dragonwing IQ-8275 EVK connected to two mini speakers. Figure : Dragonwing IQ-8275 EVK connected to two mini speakers

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Next steps

• Set up the device.
• Run sample applications.
• Develop an application.