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The Dragonwing IQ-9075 EVK features the Qualcomm Dragonwing™ IQ-9075 SoC, part of the IQ9 Series. This processor is engineered to deliver exceptional AI performance for industrial-grade applications operating in extreme environments. Designed for compute-intensive workloads, robotics, and edge AI, the IQ-9075 combines high-performance processing, advanced multimedia capabilities, and robust connectivity—all within a power-efficient architecture. Top View: Side View:

Introduction

The Dragonwing IQ-9075 EVK incorporates a system-on-module (SoM) featuring the Qualcomm IQ-9075 system-on-chip (SoC). This SoM is mounted on the mainboard, which provides connectors for multiple peripheral interfaces and supports stackable mezzanine cards for expanded functionality. The platform is designed to manage concurrent compute and AI workloads efficiently. Key Features:
  • System-on-Module (SoM)
    • Integrates the Qualcomm IQ-9075 SoC.
    • Mounted on the mainboard for modular design.
    • The IQ-9075 SoC is integrated within the IQ-9075M module, which also houses four PMICs and three LPDDR5 SDRAM memory components.
  • Mainboard Capabilities
    • Provides connectors for various peripheral interfaces.
    • Supports stackable mezzanine cards for expansion.
  • Performance and Workload Management
    • Handles multiple concurrent compute and AI workloads efficiently.
  • Peripheral Support
    • Integrated Ethernet, USB, Wi-Fi, PCIe, and Bluetooth.
  • AI Performance
    • Delivers up to 100 INT8 TOPS, enabling high-performance AI-centric and edge computing applications in industrial environments.
The following figure shows the IQ-9075 SoC within IQ-9075M module. The following figure shows the location of the different connectors on the mainboard. It also shows the main components and ports including the power plug, power on-off switch, DIP switches, camera interfaces, USB ports, debug UART port, Ethernet port, and display ports.

Device specifications

CategoryDetails
Processor & ComputeCPU: Octa-core Kryo™ Gen 6 (up to 2.36 GHz)
GPU: Adreno™ 663 (up to 800 MHz)
AI EngineDual Hexagon Tensor Processors
Up to 100 TOPS AI performance
Supports LLMs (e.g., Llama2 13B at ~12 tokens/sec)
Real-Time SubsystemQuad real-time cores @ 1.85 GHz for low-latency control
Memory & StorageRAM: Up to 36 GB LPDDR5 @ 3200 MHz with inline ECC
Storage: UFS 3.1 (up to 128 GB), NVMe via PCIe
MultimediaCamera Support: Up to 16 concurrent cameras
Display Support: Up to 12 displays (e.g., 5× 4K60, 8× 1080p60)
Video Decode: 1× 8K60, 4× 4K60, 16× 1080p60 (Formats: AV1, H.264, H.265, VP9)
Video Encode: 2× 4K60, 8× 1080p60 (Formats: H.264, H.265)
ConnectivityEthernet: 2× 2.5 GbE
Wireless: Wi-Fi 6E, Bluetooth 5.3
I/O Interfaces: PCIe, USB, CAN-FD, GPIO, UART, MIPI CSI/DSI
Operating TemperatureIndustrial-grade:
Ambient: -40°C to +85°C
Junction: -40°C to +115°C
Target ApplicationsFactory Automation
Edge AI and Generative AI
Robotics and industrial automation
Multi-camera vision systems
Autonomous Mobile Robots (AMRs)
Industrial gateways

Hardware Specifications

The following table outlines the key hardware specification of the Dragonwing IQ-9075 EVK.
Interface or featureDescription
SoCIQ-9075 (part of IQ-9075M)
Memory6 × 16 bit 36 GB LP5 3200 MHz (3x 12GB LPDDR5) (part of IQ-9075M)
PMIC4 × PMM8650AU (part of IQ-9075M)
External MCUNot present
Storage2 × 128 GB UFS, micro-SD card, EEPROMs for MACs, eMMC on mezzanine card
DisplayFour display ports:
• 2 × mini-DP (one with MST)
• 2 × DSIs (one to DSI flex, one to expansion)
DSI flex connection with touchscreen
Camera/Video input4 × Quad deserializers
4 × CSI (C-PHY or D-PHY) cameras
USBUSB0 Type-C (host or device mode)
USB1 Type-C (host mode)
USB2 micro-USB 2.0 (host or device mode)
WLAN/Bluetooth®m.2 module (NFA765A)
2 × printed antennas (Bluetooth shared with one WLAN antenna)
PCIeMainboard supported or expanded options (selected through switch):
• 1 × PCIe x4 slot or expansion (switch)
• 1 × m.2 E key (Wi-Fi) or expansion (switch)
Audio1 × I2S mic
2 × I2S speaker amps
Additional I2S on GPIOs
EthernetRJ45 2 x 2.5 GbE SGMII
CAN/CAN-FD1 × CAN/CAN-FD on low speed header on mainboard
Low-speed expansion3.3 V header for developer community with CAN, SPI, I2C, UART, I2S
Second low-speed expansionQUPs and GPIOs on mezzanine connectors
SensorsIMU: ICM-42688
QUPs on expansion
Trusted platform module (TPM)ST33HTPH2x32AHE4 on mainboard

Components included in the kit

Packaging:
  • Dragonwing IQ-9075 EVK
  • Top cover of the EVK with a mini screwdriver
  • Power supply with Type-C to barrel plug adapter
  • USB Type-C cable with Type-A adapter
  • Micro USB cable with Type-A adapter
  • Mini DisplayPort to DisplayPort cable
  • Two mini speakers
  • PCIe edge card adapter for NVM Express (NVMe)
  • Pick tool to access DIP switches
  • Pin row header for low speed connector

System Block Diagram

This figure provides a visual representation of the platform’s architecture, highlighting the main components and their interactions on the Dragonwing IQ-9075 EVK platform. For more detailed hardware information, refer to the 🔗IQ-9075 EVK hardware overview.

Next steps

With the board unpacked and the layout understood, the first thing to do is install the latest software. Continue to Update software.