> ## Documentation Index
> Fetch the complete documentation index at: https://dragonwingdocs.qualcomm.com/llms.txt
> Use this file to discover all available pages before exploring further.

# Control heat dissipation with cooling devices

The performance of some components can be adjusted to reduce heat dissipation. These components are considered as cooling devices. The CPU cores are cooling devices as their performance can be lowered to reduce heat dissipation.

For more information about cooling devices, see [index: kernel/git/torvalds/linux.git](https://git.kernel.org/pub/scm/linux/kernel/git/torvalds/linux.git/tree/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml?h=v6.6).

Use the following `sysfs` commands to read information about cooling devices:

**Note**

`<x>` in the table represents cooling device ID.

**Table : Description of commands for cooling devices**

| **Commands**                                          | **Description**                                                    |
| ----------------------------------------------------- | ------------------------------------------------------------------ |
| ls /sys/class/thermal/cooling\_device\*               | Lists all cooling devices and their IDs that the device contains   |
| cat /sys/class/thermal/cooling\_device\<x>/type       | Provides the name of the cooling device                            |
| cat /sys/class/thermal/cooling\_device\<x>/cur\_state | Reads the existing mitigation state of the cooling device          |
| cat /sys/class/thermal/cooling\_device\<x>/max\_state | Reads the maximum supported mitigation state of the cooling device |

For available CPU cooling devices for all supported platforms, see [Platform Support - Thermal Management](platform-support-thermal).