Introduction
The Dragonwing IQ-8275 EVK incorporates a system-on-module (SoM) featuring the Qualcomm IQ-8275 system-on-chip (SoC). This SoM is mounted on the mainboard, which provides connectors for multiple peripheral interfaces and supports stackable mezzanine cards for expanded functionality. The platform is designed to manage concurrent compute and AI workloads efficiently. Key Features:- System-on-Module (SoM)
- Integrates the Qualcomm IQ-8275 SoC.
- Mounted on the mainboard for modular design.
- The IQ-8275 SoC is integrated within the IQ-8275M module, which also houses two PMICs and two LPDDR5 SDRAM memory components.
- Mainboard Capabilities
- Provides connectors for various peripheral interfaces.
- Supports stackable mezzanine cards for expansion.
- Performance and Workload Management
- Handles multiple concurrent compute and AI workloads efficiently.
- Peripheral Support
- Integrated Ethernet, USB, Wi-Fi, PCIe, and Bluetooth.
- AI Performance
- Delivers up to 40 INT8 TOPS, enabling high-performance AI-centric and edge computing applications in industrial environments.
Device specifications
| Category | Details |
|---|---|
| Processor & Compute | CPU: Octa-core Kryo™ Gen 6 (2× Prime @ 2.35 GHz, 2× Gold @ 2.1 GHz, 4× Silver @ 1.95 GHz) GPU: Adreno™ 623 (up to 877 MHz) |
| AI Engine | Dual Hexagon Tensor Processors Up to 40 TOPS AI performance Supports LLMs (e.g., Llama2 13B at ~12 tokens/sec) |
| Real-Time Subsystem | Quad real-time cores @ 1.85 GHz for low-latency control |
| Memory & Storage | RAM: Up to 12 GB LPDDR5 @ 3200 MHz with inline ECC Storage: UFS 3.1 (up to 128 GB), NVMe via PCIe |
| Multimedia | Camera Support: Up to 16 concurrent cameras Display Support: Up to 12 displays (e.g., 5× 4K60, 8× 1080p60) Video Decode: 2× 4K60, 4× 4K30, 8× 1080p60, 16× 1080p30 (Formats: AV1, H.264, H.265/HEVC, VP9, MPEG-2) Video Encode: 1× 4K60, 2× 4K30, 4× 1080p60, 8× 1080p30 (Formats: H.264, H.265/HEVC) |
| Connectivity | Ethernet: 2× 2.5 GbE Wireless: Wi-Fi 6E, Bluetooth 5.3 I/O Interfaces: PCIe, USB, CAN-FD, GPIO, UART, MIPI CSI/DSI |
| Operating Temperature | Industrial-grade: Ambient: -40°C to +105°C Junction: up to +125°C |
| Target Applications | Factory Automation Edge AI and Generative AI Robotics and industrial automation Multi-camera vision systems Autonomous Mobile Robots (AMRs) Industrial gateways |
Hardware Specifications
The following table outlines the key hardware specification of the Dragonwing IQ-8275 EVK.| Interface or feature | Description |
|---|---|
| SoC | IQ-8275 (part of IQ-8275M) |
| Memory | 4 × 16 bit 12 GB LP5 3200 MHz (2 x 6 GB LPDDR5) |
| PMIC | 2 × PMM8620AU (part of IQ-8275M) |
| External MCU | Not present |
| Storage | 1 × 128 GB UFS, micro-SD card, EEPROMs for MACs, eMMC on mezzanine card |
| Display | Four display ports: • 2 × mini-DP (one with MST) • 2 × DSIs (one to DSI flex, one to expansion) DSI flex connection with touchscreen |
| Camera/Video input | 3 × Quad deserializers 3 × CSI (C-PHY or D-PHY) |
| USB | USB0 Type-C (host or device mode) USB1 Type-C (host mode) USB2 micro-USB 2.0 (host or device mode) |
| WLAN/Bluetooth® | m.2 module (NFA765A) 2 × printed antennas (Bluetooth shared with one WLAN antenna) |
| PCIe | Mainboard supported or expanded options (selected through switch): • 1 × PCIe x4 slot or expansion (switch) • 1 × m.2 E key (Wi-Fi) or expansion (switch) |
| Audio | 1 × I2S mic 2 × I2S speaker amps Additional I2S on GPIOs |
| Ethernet | RJ45 2.5 GbE SGMII |
| CAN/CAN-FD | 1 × CAN/CAN-FD on low speed header on mainboard |
| Low-speed expansion | 3.3 V header for developer community with CAN, SPI, I2C, UART, I2S |
| Second low-speed expansion | QUPs and GPIOs on mezzanine connectors |
| Sensors | IMU: ICM-42688 QUPs on expansion |
| Trusted platform module (TPM) | ST33HTPH2x32AHE4 on mainboard |
Components included in the kit
Packaging:
- Dragonwing IQ-8275 EVK
- Top cover of the EVK with a mini screwdriver
- Power supply with Type-C to barrel plug adapter
- USB Type-C cable with Type-A adapter
- Micro USB cable with Type-A adapter
- Mini DisplayPort to DisplayPort cable
- Two mini speakers
- PCIe edge card adapter for NVM Express (NVMe)
- Pick tool to access DIP switches
- Pin row header for low speed connector
System Block Diagram
This figure provides a visual representation of the platform’s architecture, highlighting the main components and their interactions on the Dragonwing IQ-8275 EVK platform.